| 摘要 |
A method for mechanically processing and releasing closed form from a transparent brittle substrate comprises the step of using ultra high speed laser pulse for drilling patterns of orifices. The orifices are formed by optical sound compression, and totally or partially expended in a transparent substrate; a scribbled line of the orifices separated from each other with distance in the transparent substrate includes a closed form pattern in the substrate. A heat source is applied in an area around the scribed line of the orifices separated with distance in the transparent substrate until the closed form pattern is released from the transparent substrate. |
