发明名称 |
RESIN COMPOSITION, PREPREG, LAMINATE PLATE, METALLIC FOIL CLAD LAMINATE, AND PRINTED CIRCUIT BOARD |
摘要 |
An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D). |
申请公布号 |
SG11201502604R(A) |
申请公布日期 |
2015.05.28 |
申请号 |
SG11201502604R |
申请日期 |
2013.10.18 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
CHIBA, TOMO;TAKAHASHI, HIROSHI;SHIGA, EISUKE;OGASHIWA, TAKAAKI |
分类号 |
C08G59/20;B32B15/08;C08J5/24;C08K3/00;C08L63/00;H05K1/03 |
主分类号 |
C08G59/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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