| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a plating device capable of further minimizing deviation of the plating thickness of an object to be plated.SOLUTION: The plating device includes: a plating bath 100 accommodating an object to be plated; and a plurality of anodes 200, which are separated and installed in a plurality of rows and columns in the plating bath and to each of which electric current is supplied independently. Each of the anodes is formed entirely or partly in a circular shape.</p> |
