发明名称 CONDUCTIVE ADHESIVE SHEET AND ELECTRONIC DEVICE
摘要 The present invention addresses the problem of providing a conductive adhesive sheet which exhibits good adhesiveness and conductivity even if the conductive adhesive sheet is thinner than the conventional ones. The present invention relates to a thin conductive adhesive sheet which has a total thickness of 30 μm or less, and which is characterized by comprising a conductive base and a conductive adhesive layer containing conductive particles. This thin conductive adhesive sheet is also characterized in that: the particle diameter (d85) of the conductive particles is within the range of 5-9 μm; and the thickness of the adhesive layer is within the range of 1-6 μm.
申请公布号 WO2015076174(A1) 申请公布日期 2015.05.28
申请号 WO2014JP80046 申请日期 2014.11.13
申请人 DIC CORPORATION 发明人 YAMAKAMI AKIRA;KURATA YOSHIHIRO
分类号 C09J7/02;C09J9/02;C09J133/00 主分类号 C09J7/02
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