METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

摘要

Provided is a method for manufacturing an electronic component, which is capable of easily forming a cured adhesive layer with high accuracy. A method for manufacturing a curable film electronic component (1) according to the present invention comprises: an application step wherein an adhesive layer (12) is formed by applying an adhesive over a first electronic component main body (2) with use of an inkjet device (11); a first light irradiation step wherein the adhesive layer (12A) is irradiated with light from a first light irradiation part (13); a bonding step wherein a second electronic component main body (4) is arranged on and bonded to the adhesive layer (12B), which has been irradiated with light; and a step for obtaining an electronic component (1) by curing the adhesive layer (12B) by means of heating. The inkjet device (11) comprises an ink tank in which the adhesive is retained, an ejection part, and a circulation channel part. In the above-described application step, the adhesive is applied, while being circulated within the inkjet device (11).