HEAT-INSULATION FILM, AND HEAT-INSULATION-FILM STRUCTURE

摘要

Provided are: a heat-insulation film with which a heat-insulation effect is improved; and a heat-insulation-film structure. In this heat-insulation film (3), pieces of a porous plate-shaped filler (1) are dispersively disposed in a matrix (3m) for binding together the pieces of the porous plate-shaped filler (1). The pieces of the porous plate-shaped filler (1) have: a plate shape with an aspect ratio of at least 3; a minimum length of 0.1-50 µm; and a porosity of 20-90%. In a cross section parallel to a film thickness direction, when the heat-insulation film (3) is divided, in a direction orthogonal to the film thickness direction, into regions having a region length (26) defined as 10% of the average maximum length of the pieces of the porous plate-shaped filler (1), the regions in which the surface area ratio of the porous plate-shaped filler (1) is less than 50% of the region surface area account for not more than 10% of the total number of regions. This heat-insulation film (3) in which the porous plate-shaped filler (1) is used achieves a longer heat-transfer route length and a lower heat conductivity in comparison to when spherical or cubic fillers are used.