发明名称 LED MODULE
摘要 The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
申请公布号 EP2858132(A4) 申请公布日期 2015.05.27
申请号 EP20130796411 申请日期 2013.05.24
申请人 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. 发明人 URANO, YOJI;NAKAMURA, AKIFUMI;IOKA, HAYATO;IMAI, RYOJI;GODA, JUN;HIRANO, TORU;SUZUKI, MASANORI;HYUGA, HIDEAKI
分类号 H01L33/60;H01L25/075;H01L33/48;H01L33/50 主分类号 H01L33/60
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