CHEMICAL SOLUTION FOR FORMING PROTECTIVE FILM

摘要

Disclosed is a chemical solution for forming a water-repellent protective film on a wafer. The chemical solution is a chemical solution containing a water-repellent-protective-film-forming agent for forming the water-repellent protective film, at the time of cleaning the wafer which has a finely uneven pattern at its surface and contains at least at a part of a surface of a recessed portion of the uneven pattern at least one kind of matter selected from the group consisting of titanium, titanium nitride, tungsten, aluminum, copper, tin, tantalum nitride, ruthenium and silicon, at least on the surface of the recessed portion. The chemical solution is characterized in that the water-repellent-protective-film-forming agent is a water-insoluble surfactant. The water-repellent protective film formed with the chemical solution is capable of preventing a pattern collapse of the wafer, in a cleaning step.