SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD

摘要

A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass% or more and 4 mass% or less, the nickel content is 0.01 mass% or more and 0.15 mass% or less, and the cobalt content is 0.001 mass% or more and 0.008 mass% or less.