| 发明名称 |
Bonding using hot-melt adhesives |
| 摘要 |
The invention relates to the use of a hot-melt adhesive having high hardness for adhesive bonding of metal films or foils, paper films or foils, and/or plastic films or foils. The invention further relates to a method for adhesively bonding a metal film or foil, paper film or foil, and/or plastic film or foil onto a substrate. |
| 申请公布号 |
US9039862(B2) |
申请公布日期 |
2015.05.26 |
| 申请号 |
US201313793377 |
申请日期 |
2013.03.11 |
| 申请人 |
HENKEL AG & CO. KGAA |
发明人 |
Lotz Juergen;Kasper Dirk;Pielert Lutz |
| 分类号 |
C09J123/12;B32B7/12;B32B29/02;B32B15/08;C09J123/14;B32B29/00;C08L23/14;C08K5/134;C08L91/06 |
主分类号 |
C09J123/12 |
| 代理机构 |
|
代理人 |
Lehmann Sun Hee |
| 主权项 |
1. A hot-melt adhesive comprising:
(A) 10 to 80 wt % of at least one thermomechanically degraded polypropylene copolymer, (B) 5 to 60 wt % of at least one tackifying resin, (C) 0 to 40 wt % of at least one further additive,
wherein the hot-melt adhesive has a Shore D hardness above 50 measured in accordance with DIN EN ISO 868:2003;wherein the components (A), (B) and (C) totals to 100 wt % of the hot-melt adhesive; andwherein the adhesive is adapted for bonding a film/foil selected from a metal film, metal foil, paper film, paper foil, plastic film or plastic foil. |
| 地址 |
Duesseldorf DE |
