发明名称 |
Diode-based devices and methods for making the same |
摘要 |
In accordance with an embodiment, a diode comprises a substrate, a dielectric material including an opening that exposes a portion of the substrate, the opening having an aspect ratio of at least 1, a bottom diode material including a lower region disposed at least partly in the opening and an upper region extending above the opening, the bottom diode material comprising a semiconductor material that is lattice mismatched to the substrate, a top diode material proximate the upper region of the bottom diode material, and an active diode region between the top and bottom diode materials, the active diode region including a surface extending away from the top surface of the substrate. |
申请公布号 |
US9040331(B2) |
申请公布日期 |
2015.05.26 |
申请号 |
US201213554516 |
申请日期 |
2012.07.20 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Lochtefeld Anthony J. |
分类号 |
H01L33/40;H01L33/24;H01L31/18;H01L21/02;H01L29/04;H01L29/88;H01L33/08;H01L33/18 |
主分类号 |
H01L33/40 |
代理机构 |
Slater & Matsil, L.L.P. |
代理人 |
Slater & Matsil, L.L.P. |
主权项 |
1. A method of forming a diode, the method comprising:
depositing a layer of a dielectric material over a substrate, the dielectric material having a dielectric surface distal from the substrate; patterning a first opening in the dielectric material to expose a first portion of the substrate, the first opening being through the dielectric surface of the dielectric material, the first opening having an aspect ratio of at least 1; forming a first bottom diode region by growing a compound semiconductor material that is lattice mismatched to the substrate in and above the first opening, the first bottom diode region having a first sidewall surface extending above and away from the dielectric surface of the dielectric material; forming a first active diode region directly adjacent the first sidewall surface of the first bottom diode region, the first active diode region having a second sidewall surface extending above and away from the dielectric surface of the dielectric material; and forming a top diode region directly adjacent the second sidewall surface of the first active diode region in a plane parallel to the dielectric surface of the dielectric material intersecting the first bottom diode region, the first active diode region, and the top diode region. |
地址 |
Hsin-Chu TW |