SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided are a semiconductor package which can arrange semiconductor chips in layers regardless of the size of the semiconductor chips, and a manufacturing method thereof. According to the present invention, the semiconductor package comprises: a package base substrate; at least one first semiconductor chip attached on the package base substrate; a first molding member exposing an upper surface of at least one first semiconductor chip; at least one second semiconductor chip arranged on at least one first semiconductor chip to lye across at least one first semiconductor chip and the fist molding member; and a second molding member covering at least one second semiconductor chip.