发明名称 HEAT-INSULATING WALL, AND HEAT-INSULATING HOUSING AND METHOD FOR PRODUCING THE SAME
摘要 A heat-insulating housing (21) includes: a wall body; and an open-cell resin body (4) of thermosetting resin with which a heat-insulating space formed by the wall body is filled by integral foaming, the open-cell resin body including: a plurality of cells (47); a cell film portion (42); a cell skeleton portion (43); a first through-hole (44) formed so as to extend through the cell film portion; and a second through-hole (45) formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole.
申请公布号 US2015140244(A1) 申请公布日期 2015.05.21
申请号 US201314398693 申请日期 2013.06.20
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 Uekado Kazutaka;Hirai Tsuyoki
分类号 F16L59/06;F25D23/06;B29C44/18;E04C2/20;E04B1/80 主分类号 F16L59/06
代理机构 代理人
主权项 1. A heat-insulating wall comprising: a wall body whose hollow portion is a heat-insulating space; and an open-cell resin body formed of a thermosetting resin, with which the heat-insulating space is filled by integral foaming, the open-cell resin body comprising: a plurality of cells; a cell film portion which is formed at a location where the cells are adjacent to one another; a cell skeleton portion which is formed at a location where the cells are adjacent to one another and which is formed in such a manner that a distance between the adjacent cells is greater than a thickness of the cell film portion; a first through-hole formed so as to extend through the cell film portion; and a second through-hole formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole, the open-cell resin body further comprises a dispersed powder, the powder is incompatible with the thermosetting resin, and the open-cell resin body comprises one of an open-cell urethane foam and an open-cell phenol foam.
地址 Osaka-shi, Osaka JP