发明名称 |
HEAT-INSULATING WALL, AND HEAT-INSULATING HOUSING AND METHOD FOR PRODUCING THE SAME |
摘要 |
A heat-insulating housing (21) includes: a wall body; and an open-cell resin body (4) of thermosetting resin with which a heat-insulating space formed by the wall body is filled by integral foaming, the open-cell resin body including: a plurality of cells (47); a cell film portion (42); a cell skeleton portion (43); a first through-hole (44) formed so as to extend through the cell film portion; and a second through-hole (45) formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole. |
申请公布号 |
US2015140244(A1) |
申请公布日期 |
2015.05.21 |
申请号 |
US201314398693 |
申请日期 |
2013.06.20 |
申请人 |
Panasonic Intellectual Property Management Co., Ltd. |
发明人 |
Uekado Kazutaka;Hirai Tsuyoki |
分类号 |
F16L59/06;F25D23/06;B29C44/18;E04C2/20;E04B1/80 |
主分类号 |
F16L59/06 |
代理机构 |
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代理人 |
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主权项 |
1. A heat-insulating wall comprising:
a wall body whose hollow portion is a heat-insulating space; and an open-cell resin body formed of a thermosetting resin, with which the heat-insulating space is filled by integral foaming, the open-cell resin body comprising: a plurality of cells; a cell film portion which is formed at a location where the cells are adjacent to one another; a cell skeleton portion which is formed at a location where the cells are adjacent to one another and which is formed in such a manner that a distance between the adjacent cells is greater than a thickness of the cell film portion; a first through-hole formed so as to extend through the cell film portion; and a second through-hole formed so as to extend through the cell skeleton portion, wherein the plurality of cells communicate with one another through the first through-hole and the second through-hole, the open-cell resin body further comprises a dispersed powder, the powder is incompatible with the thermosetting resin, and the open-cell resin body comprises one of an open-cell urethane foam and an open-cell phenol foam. |
地址 |
Osaka-shi, Osaka JP |