High Speed Backside Illuminated, Front Side Contact Photodiode Array

摘要

The present specification discloses front-side contact back-side illuminated (FSC-BSL) photodiode array having improved characteristics such as high speed of each photodiode, uniformity of the bias voltage applied to different photodiode, low bias voltage, reduced resistance of each photodiode, and an associated reduction in noise. The photodiode array is made of photodiodes with front metallic cathode pads, front metallic anode pad, back metallic cathode pads, n+ doped regions and a p+ doped region. The front metallic cathode pads physically contact the n+ doped regions and the front metallic anode pad physically contacts the p+ doped region. The back metallic cathode pads physically contact the n+ doped region.

主权项

1. A photodiode array having a front side and a back side separated by a layer of silicon and a top edge, a bottom edge, a right edge, and a left edge, comprising:
a. a plurality of metallic cathode pads extending from said front side of the photodiode array wherein each of said metallic cathode pads is in physical contact with at least one n+ doped region; b. a plurality of metallic cathode pads extending from said back side of the photodiode array wherein each of said metallic cathode pads is in physical contact with a second n+ doped region; c. a metallic grid on the front side of said array, wherein said metallic grid forms a plurality of rows in parallel to said top edge and bottom edge and perpendicular to said right edge and left edge, wherein said metallic grid forms a plurality of columns in parallel to said right edge and left edge and perpendicular to said top edge and bottom edge, and wherein said metallic grid interconnects each of said plurality of metallic cathode pads extending from said front side of the photodiode array; and d. a metallic grid on the back side of said array, wherein said metallic grid forms a plurality of rows in parallel to said top edge and bottom edge and perpendicular to said right edge and left edge, wherein said metallic grid forms a plurality of columns in parallel to said right edge and left edge and perpendicular to said top edge and bottom edge, and wherein said metallic grid interconnects each of said plurality of metallic cathode pads extending from said back side of the photodiode array.