发明名称 Method of fabricating a dual-gate structure that prevents cut-through and lowered mobility
摘要 A method of fabricating a dual-gate semiconductor device, including forming a first PMOS transistor on a semiconductor substrate, the first PMOS transistor having a first gate electrode and a first gate insulation layer; and forming a first NMOS transistor on the semiconductor substrate, the first NMOS transistor having a second gate electrode and a second gate insulation layer. The gate insulation layer of the first PMOS transistor is a silicon nitride oxide layer.
申请公布号 US7566604(B2) 申请公布日期 2009.07.28
申请号 US20070727290 申请日期 2007.03.26
申请人 OKI SEMICONDUCTOR CO., LTD. 发明人 MOCHIZUKI MARIE
分类号 H01L21/8234;H01L21/8238;H01L29/78 主分类号 H01L21/8234
代理机构 代理人
主权项
地址