LED DEVICE WITH IMPROVED THERMAL PERFORMANCE

摘要

An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.

主权项

1. A method of packaging light-emitting diodes (LEDs), comprising:
forming a plurality of openings in a wafer; forming a conductor on the wafer; and coupling a plurality of LEDs to the conductor, wherein top surface of the LEDs are not co-planar with a top surface of the conductor.