| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of reducing high-frequency noise.SOLUTION: A semiconductor device 100 comprises: a semiconductor chip 1; a die pad 3 on which the semiconductor chip 1 is mounted; a lead 7 that is electrically connected to a gate electrode pad 11 formed in the semiconductor chip 1; and a pad 20 that is arranged in parallel with the semiconductor chip 1. One main surface of the pad 20 is electrically connected to the gate electrode pad 11 by a wiring member 15, and the other main surface is bonded to the lead 7. |
