METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE

摘要

Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

主权项

1. A method for integrating a light emitting device comprising:
picking up a micro LED device from a carrier substrate with a transfer head; placing the micro LED device on a receiving substrate; releasing the micro LED device from the transfer head; applying a passivation layer over the receiving substrate and laterally around the micro LED device; hardening the passivation layer; and etching the passivation layer, such that a top surface of the micro LED device and a top surface of a conductive line on the receiving substrate are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above a top surface of the passivation layer after etching the passivation layer.