Thermoelectric Conversion Module and Method for Making it

摘要

According to a first aspect, the invention relates to a thermoelectric module (10) that comprises a thermoelectric layer (15) comprising one p-type (7p) and one n-type (7n) portions presenting together an upper and a lower main surfaces (11,12). The thermoelectric module (10) further comprises a first and a second thermal resistor elements (1r, 2r), and a first thermal bridge element (3c), between and adjacent to the first and second thermal resistor elements (1r, 2r). The first and second thermal resistor elements (1r, 2r) and the first thermal bridge element (3c) cover the whole lower main surface (12). The p-type (7p) and the n-type (7n) portions are adjacent and directly coupled by an interface (7i). The first thermal bridge element (3c) spans at least over the orthogonal projection of the interface (7i) on the lower main surface (12).

主权项

1. Thermoelectric module comprising:
a thermoelectric layer of substantially constant thickness, t, comprising one p-type portion and one n-type portion, both portions presenting together an upper and a lower main surfaces separated by said thickness t and extending over the whole thickness t of the thermoelectric layer; a first and a second thermal resistor elements in thermal contact with said lower main surface; a first thermal bridge element in thermal contact with said lower main surface, between and adjacent to the first and second thermal resistor elements;such that said first and second thermal resistor elements and said first thermal bridge element cover the whole lower main surface, and such that said first thermal bridge element is globally able to transfer heat between said thermoelectric layer and the surrounding environment at a substantially higher rate than the first and second thermal resistor elements;wherein:
said p-type and said n-type portions are adjacent and directly coupled by an interface; and in that said first thermal bridge element spans at least over the orthogonal projection of said interface onto said lower main surface.