| 摘要 |
Disclosed are a printed circuit board, a semiconductor package including the same, and a method for manufacturing the printed circuit board. According to one aspect of the present invention, provided is the printed circuit board which includes a package substrate which includes a mounting region to mount a semiconductor chip and an outer region which surrounds the mounting region, a first central circuit pattern which is formed on the mounting region of one side of the package substrate, a second central circuit pattern which is formed on the mounting region of the other side of the package substrate and is thicker than the first central circuit pattern, a first outer circuit pattern which is formed on the outer region of one side of the package substrate, and a second outer circuit pattern which is formed on the outer region of the other side of the package substrate and is thinner than the first outer circuit pattern. |
