发明名称 半導体基板の評価方法および半導体基板の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor substrate most appropriate for a product such as CCD and a CMOS sensor which require high yield; and provide an evaluation method capable of detecting a semiconductor substrate with respect to whether a striation occurs in a solid-state image sensor for preventing a dark current, white scratches occurring in formation of the solid-state image sensor and the like. <P>SOLUTION: An evaluation method of a semiconductor substrate by a leakage current, comprises: performing an oxygen precipitation heat treatment on the semiconductor substrate; forming PN junction; measuring a diffusion current; and evaluating the semiconductor substrate with respect to a striation by using the diffusion current obtained by the measurement. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5720557(B2) 申请公布日期 2015.05.20
申请号 JP20110274247 申请日期 2011.12.15
申请人 发明人
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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