| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing apparatus capable of forming the desired thickness of a workpiece by controlling temperature distribution of a chuck table holding the workpiece. <P>SOLUTION: The polishing apparatus includes: a chuck table for holding a workpiece; and a polisher equipped with a polishing pad for polishing the workpiece held on the chuck table. The chuck table has a holding table that has a holding surface for holding the workpiece and a supporting member that supports the holding table. In the supporting member, there is formed a fluid passage that is formed in a spiral form from a center thereof toward an outer periphery thereof. In the fluid passage, there is provided a control fluid supply means that supplies temperature control fluid to the fluid passage and that controls temperature distribution in a region from a center of the holding table to the outer periphery of the holding table. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
