发明名称 COPPER ALLOY AND COPPER ALLOY FORMING MATERIAL
摘要 Copper alloys according to first to third aspects contain Mg at a content of 3.3% by atom to 6.9% by atom, with the balance substantially being Cu and unavoidable impurities, wherein an oxygen content is in a range of 500 ppm by atom or less, and either one or both of the following conditions (a) and (b) are satisfied: (a) when a Mg content is set to X% by atom, an electrical conductivity à (%IACS) satisfies the following Expression (1), à ‰¤ {1.7241/(-0.0347×X 2 + 0.6569×X + 1.7)}×100 ··· (1); and (b) an average number of intermetallic compounds, which have grain sizes of 0.1 µm or more and contain Cu and Mg as main components, is in a range of 1 piece/µm 2 or less. A copper alloy according to a fourth aspect further contains one or more selected from a group consisting of Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, and Zr at a total content of 0.01% by atom to 3.0% by atom, and satisfies the condition (b).
申请公布号 EP2781611(A4) 申请公布日期 2015.05.20
申请号 EP20120849153 申请日期 2012.11.06
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 MAKI KAZUNARI;ITO YUKI
分类号 C22C9/00;C22F1/08 主分类号 C22C9/00
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