COMPOSITION OF PHOTO SENSITIVE RESIN INCLUDING POLYIMIDE PRECURSOR

摘要

The present invention relates to a photosensitive resin composition, which is made from at least two residual groups derived from aromatic dianhydride and at two residual groups derived from organic diamine wherein at least one residual group of the residual group derived from the aromatic dianhydride is replaced with silane based epoxy compounds and comprises polyimide precursors whose weight-average molecular weight is between 2,000 and 200,000.