发明名称 |
Nanometer-scale level structures and fabrication method for digital etching of nanometer-scale level structures |
摘要 |
A ramped etalon cavity structure and a method of fabricating same. A bi-layer stack is deposited on a substrate. The bi-layer stack includes a plurality of bi-layers. Each bi-layer of the plurality of bi-layers includes an etch stop layer and a bulk layer. A three dimensional photoresist structure is formed by using gray-tone lithography. The three dimensional photoresist is plasma etched into the bi-layer stack, thereby generating an etched bi-layer stack. The etched bi-layer stack is chemically etched with a first chemical etchant to generate a multiple-step structure on the substrate, wherein the first chemical etchant stops at the etch stop layer. |
申请公布号 |
US9035408(B2) |
申请公布日期 |
2015.05.19 |
申请号 |
US201414269292 |
申请日期 |
2014.05.05 |
申请人 |
The United States of America, as represented by the Secretary of the Navy |
发明人 |
Boudreau Andrew J.;Yetzbacher Michael K.;Christophersen Marc;Phlips Bernard F. |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
US Naval Research Laboratory |
代理人 |
US Naval Research Laboratory ;Koshy Suresh |
主权项 |
1. A method of fabricating a multiple-step structure on a substrate, the method comprising:
depositing a bi-layer stack on a substrate, the bi-layer stack comprising a plurality of bi-layers, each bi-layer of the plurality of bi-layers comprising an etch stop layer and a bulk layer; forming a three dimensional photoresist structure by using gray-tone lithography; plasma etching the three dimensional photoresist into the bi-layer stack, thereby generating an etched bi-layer stack; and chemically etching the etched hi-layer stack with a first chemical etchant to generate a multiple-step structure on the substrate, wherein the first chemical etchant stops at the etch stop layer. |
地址 |
Washington DC US |