发明名称 |
Methods of forming variable resistive memory devices |
摘要 |
A method of forming a variable resistive memory device includes forming a conductive pattern that alternates with a first insulation pattern along a first direction on a substrate that is parallel with a surface of the substrate, forming a preliminary sacrificial pattern on the conductive pattern that contacts a sidewall of the first insulation pattern, etching the conductive pattern using the preliminary sacrificial pattern as an etch masks to form a preliminary bottom electrode pattern, patterning the preliminary sacrificial pattern and the preliminary bottom electrode pattern to form a sacrificial pattern and a bottom electrode pattern that each include at least two portions which are separated from each other along a second direction intersecting the first direction, and replacing the sacrificial pattern with a variable resistive pattern. |
申请公布号 |
US9034719(B2) |
申请公布日期 |
2015.05.19 |
申请号 |
US201414315991 |
申请日期 |
2014.06.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Kang Myung Jin |
分类号 |
H01L21/20;H01L45/00;H01L27/24 |
主分类号 |
H01L21/20 |
代理机构 |
Lee & Morse, P.C. |
代理人 |
Lee & Morse, P.C. |
主权项 |
1. A method of forming a variable resistive memory device, the method comprising:
forming a first insulation pattern on a substrate, such that the first insulation pattern includes portions on either side of a trench; forming a conductive pattern on the substrate; forming a preliminary sacrificial pattern of an insulating material, such that a portion of the preliminary sacrificial pattern is in the trench and contacts a sidewall of at least one of the portions of the first insulation pattern; etching the conductive pattern using the preliminary sacrificial pattern as an etch mask, thereby forming a preliminary bottom electrode pattern; and replacing the sacrificial pattern with a variable resistive pattern. |
地址 |
Suwon-si, Gyeonggi-do KR |