MEMS device and method of formation thereof

摘要

The present disclosure provides a method including providing a first substrate; and forming a microelectromechanical system (MEMS) device on a first surface of the first substrate. A bond pad is formed on at least one bonding site on the first surface of the first substrate. The bonding site is recessed from the first surface. Thus, a top surface of the bond pad may lie below the plane of the top surface of the substrate. A device with recessed connective element(s) (e.g., bond pad) is also described. In further embodiments, a protective layer is formed on the recessed connective element during dicing of a substrate.

主权项

1. A method, comprising:
etching a first substrate to form a first recess and a second recess; forming a first connective element in the first recess; forming a protective layer on the first substrate to cover the first recess and the second recess; removing at least a portion of the protective layer from the first substrate; and bonding a second substrate to the first substrate by a second connective element.