| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a joined body having a sufficiently low thermal resistance, and capable of suppressing the cracking of a ceramics substrate when a cooling/heating cycle is loaded, and to provide a substrate for power module consisting of the joined body.SOLUTION: A joined body includes a ceramics substrate 11, Cu layers 12A, 13A formed by bonding a Cu plate to one side of the ceramics substrate 11, and Al layers 12B, 13B formed by bonding an Al plate having a purity of 99.95 mass% or more to the side of the Cu layer opposite from the side where the ceramics substrate is bonded. The thickness of the Cu plate is 0.05 mm or more, and the thickness of the Al plate is 0.2-0.6 mm.</p> |
