ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and a method of mounting an electronic component capable of increasing the versatility for size and shape of electronic components while improving the running cost performance.SOLUTION: The electronic component mounting apparatus includes: a mounting head 21 which has a first chuck 32A for chucking one of plural leads 3a of an electronic component 3, a second chuck 32B for chucking another lead 3a and a positioning mechanism 31C for adjusting the positional relationship between the first chuck 32A and the second chuck 32B to hold the electronic component 3; and a mounting head movement mechanism 22 that moves the mounting head 21 to insert the leads 3a of the electronic component 3 held by the mounting head 21 into the respective lead insertion holes 2a formed in the circuit board 2.