发明名称 WAFER FOR TEMPERATURE MEASUREMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a wafer for temperature measurement which allows for temperature measurement of a wafer with high sensitivity by using a wireless system, without increasing the thickness thereof, with a simple configuration.SOLUTION: A wafer W for temperature measurement includes a base substrate 11, a cover glass 12, an antenna 15 formed on a flexible printed wiring board 14, three crystal resonators 1a, 1b, 1c connected in parallel with the antenna 15 and having resonant frequencies different from each other, and a spacer. The antenna 15 formed on the flexible printed wiring board 14, three crystal resonators 1a, 1b, 1c, and spacer are surrounded fluid-tightly by the base substrate 11, cover glass 12, and a fluororesin 16.</p>
申请公布号 JP2015095477(A) 申请公布日期 2015.05.18
申请号 JP20130232164 申请日期 2013.11.08
申请人 SEBACS CO LTD 发明人 KAMEI KENJI;TSUTSUI SEIJI
分类号 H01L21/66;H03H9/13 主分类号 H01L21/66
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