发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
摘要 |
Provided in an aspect of the present invention is a light emitting device package which comprises a package substrate; a light emitting device mounted on the package substrate, and including multiple nano light emitting structures; a resin part formed on the package substrate, and encapsulating the light emitting device; and a light scattering agent dispersed in the resin part, and composed of a material having refractive index higher than the material forming the resin part. According to the embodiment, the light emitting device package applying a light emitting device having a nano light emitting structure is expected to have increased light extraction efficiency. |
申请公布号 |
KR20150053586(A) |
申请公布日期 |
2015.05.18 |
申请号 |
KR20130135722 |
申请日期 |
2013.11.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YUN, MI JEONG;SON, JOONG KON;KUROKAWA YOICHI;HWANG, KYUNG WOOK |
分类号 |
H01L33/52;H01L33/48;H01L33/56 |
主分类号 |
H01L33/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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