发明名称 LIGHT EMITTING DEVICE PACKAGE
摘要 Provided in an aspect of the present invention is a light emitting device package which comprises a package substrate; a light emitting device mounted on the package substrate, and including multiple nano light emitting structures; a resin part formed on the package substrate, and encapsulating the light emitting device; and a light scattering agent dispersed in the resin part, and composed of a material having refractive index higher than the material forming the resin part. According to the embodiment, the light emitting device package applying a light emitting device having a nano light emitting structure is expected to have increased light extraction efficiency.
申请公布号 KR20150053586(A) 申请公布日期 2015.05.18
申请号 KR20130135722 申请日期 2013.11.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YUN, MI JEONG;SON, JOONG KON;KUROKAWA YOICHI;HWANG, KYUNG WOOK
分类号 H01L33/52;H01L33/48;H01L33/56 主分类号 H01L33/52
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