热塑性液晶聚合物薄膜、电路基板、及其制造方法;THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM, CIRCUIT BOARD, AND METHOD FOR PRODUCING THEM

摘要

本发明提供一种热接着性优异之热塑性液晶聚合物薄膜、电路基板、及其制造方法。该热塑性液晶聚合物薄膜的分子配向度SOR为0.8~1.4，且含水率为300ppm以下。该电路基板具备复数片选自至少一侧的面上形成有导体层之绝缘基板、接合片(bonding sheet)及覆盖层(coverlay)之至少一种的电路基板材料。该电路基板材料之至少1片，系热塑性液晶聚合物薄膜。在根据JIS C5012之方法之焊浴290℃的环境下将电路基板静置60秒的情况，电路基板具有焊接耐热性。 To provide a thermoplastic liquid crystal polymer film excellent in heat adhesiveness, a circuit board, and method for producing them. The thermoplastic liquid crystal polymer film has a segment orientation ratio (SOR) of 0.8 to 1.4 and a moisture percentage of 300 ppm or lower. The circuit board comprises two or more sheets of circuit board materials which are at least one circuit board material species selected from the group consisting of an insulated board comprising a conductor layer at least one surface thereof, a bonding sheet, and a coverlay. The circuit board comprises at least one sheet of circuit board material made of a thermoplastic liquid crystal polymer film. The circuit board has a resistance to the heat of soldering, where the circuit board is stably immersed in a solder bath at 290℃