PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention relates to a printed circuit board and a manufacturing method thereof, and more specifically, to a printed circuit board having a reliable via structure by embedding a device to a substrate, and to a manufacturing method thereof. As a surface in which brittle fracture of an intermetallic compound according to a reaction of a metal via layer and an element layer occurs is changed into a surface causing plastic deformation, fracture speed according to processing curing effect can be reduced. Also, electric connection of contact surface is maintained by forming the stable surface of the metal via layer so that stable electrical performance can be maintained after long term thermal treatment.