| 摘要 |
A semiconductor chip package structure for achieving electrical connection without using a wire-bonding process includes: a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip receives in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed among the conductive pads in order to insulate the conductive pads from each other. The first conductive layers are formed on the first insulative layer, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed among the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.
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