DEVICE FOR EVALUATING FILLING PROPERTY OF PLATING LIQUID, SUBSTRATE FOR EVALUATING FILLING PROPERTY OF PLATING LIQUID, ELECTRODE GROUP FOR EVALUATING FILLING PROPERTY OF PLATING LIQUID, AND RECYCLING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an evaluation device capable of simply evaluating a filling property of the copper plating liquid to be used when embedding a copper metal in via holes or trenches.SOLUTION: The device for evaluating a filling property of the copper plating liquid includes: a second electrode 28; first electrodes 12, 18, 20, 22, and 24 whose entire uppermost surface is made of a conductor and having at least one bottomed structure or whose average surface roughness value R is 1 nm or more; and a third electrode 26 for supplying at least a part of the electric potentials of the first electrodes in a homo-polar or hetero-polar manner. Each electrode previously determines each area and mutual positional relation. The electrode group and the like set based on an electrode area and a mutual positional relation as well as the electrode group or the substrate are brought into contact with the copper plating liquid to be evaluated. When the voltage in which the voltage of the first electrode is time-changed in a negative direction is applied to the second electrode, a measuring instrument for measuring the current value in a specific voltage value is provided in a voltage range in which the change of the electric current flowing between the first electrode and the second electrode is observed.