CHAMBER CLEANING WHEN USING ACID CHEMISTRIES TO FABRICATE MICROELECTRONIC DEVICES AND PRECURSORS THEREOF

摘要

The present invention provides treatment strategies that reduce contamination on wafer surfaces that are treated with acid chemistries. The strategies are suitable for use with a wide variety of wafers, including those including sensitive microelectronic features or precursors thereof. These strategies involve a combination of neutralizing and rinsing strategies that quickly and effectively remove residual acid and acid by-products from both the front side of workpiece(s) as well as from other processing chamber surfaces that can be causes of contamination.

主权项

1. A method of cleaning a chamber; comprising the steps of:
(a) positioning a microelectronic device precursor in a treatment chamber comprising an interior chamber surface that overlies the precursor; (b) treating the workpiece with an a, acidic composition under conditions such that an acid residue collects on at least a portion of the interior chamber surface overlying the workpiece; (c) causing a neutralizing composition comprising at least one base to contact acid residue on the interior chamber surface; and (d) after the neutralizing composition contacts the acid residue, rinsing the interior chamber surface.