LIGHT-EMITTING DIODE PACKAGE

摘要

The invention provides a light-emitting diode package. The light-emitting diode package includes a lead frame having a first lead and a second lead separated from each other by a space. A transparent plastic housing surrounds and encapsulates the lead frame to form a cup-shaped body having a recessed accommodating space. A bottom of the space is defined as a function area. The function area comprises an exposed surface of the first lead and an exposed surface of the second lead. A top of the space is defined as an opening for light emission. A light-emitting diode chip is mounted on the first lead in the function area, electrically connected to the second lead. A white reflective material is disposed on an isolation area in the function area, covering the first and second leads adjacent to the space. An encapsulation material fills the recessed accommodating space.

主权项

1. A light-emitting diode package, comprising:
a lead frame having a first lead and a second lead separated from each other by a space; a transparent plastic housing surrounding and encapsulating the lead frame to form a cup-shaped body having a recessed accommodating space, wherein a bottom of the space is defined as a function area, the function area comprises an exposed surface of the first lead and an exposed surface of the second lead, and a top of the space is defined as an opening for light emission; a light-emitting diode chip mounted on the exposed surface of the first lead in the function area, electrically connected to the exposed surface of the second lead; a white reflective material disposed on an isolation area in the function area, covering the exposed surfaces of the first and second leads adjacent to the space; and an encapsulation material filling the recessed accommodating space.