发明名称 SOCKET INTERPOSER HAVING A MULTI-MODAL I/O INTERFACE
摘要 Exemplary embodiments include a socket interposer having a plurality of connectors configured to attach to a server board, the server board including: a first processor socket having a processor form factor, and a first memory associated with the first processor socket, a processor inserted into the at least first processor socket, the processor having access to the first memory, and a second processor socket having the processor form factor, and a second memory associated with the second processor socket, wherein the plurality of connectors are configured to fit the processor form factor; and a multi-modal I/O interface having a first mode and a second mode, wherein in the first mode provides processor-to-processor communication, and the second mode provides the first processor with accessibility to the second memory associated with the second processor socket.
申请公布号 US2015134868(A1) 申请公布日期 2015.05.14
申请号 US201414454309 申请日期 2014.08.07
申请人 Samsung Electronics Co., Ltd. 发明人 Shaeffer Ian P.;Ping Zhan
分类号 G06F13/12;G06F15/17;G11C7/10;G06F13/40 主分类号 G06F13/12
代理机构 代理人
主权项 1. A socket interposer, comprising: a plurality of connectors configured to attach to a server board, the server board including: a first processor socket having a processor form factor, and a first memory associated with the first processor socket,a processor inserted into the at least first processor socket, the processor having access to the first memory, anda second processor socket having the processor form factor, and a second memory associated with the second processor socket, wherein the plurality of connectors are configured to fit the processor form factor; and a multi-modal I/O interface having a first mode and a second mode, wherein in the first mode provides processor-to-processor communication, and the second mode provides the first processor with accessibility to the second memory associated with the second processor socket.
地址 Gyeonggi-do KR