发明名称 DOUBLE-SHOT INJECTION MOLDING FORMED LED LEAD FRAME STRUCTURE
摘要 A double-shot injection molding formed LED lead frame structure includes an inner base having an inner bottom portion and an inner surrounding wall surrounding on top of the inner bottom portion, the inner surrounding wall forming a central hollow portion on top of the inner bottom portion, and the inner bottom portion having an inner surface facing toward the central hollow portion; a plurality of conductive pins with each one thereof constructed by a soldering section, a securement section and an extension section respectively; and an outer base comprising an outer bottom portion attached to a bottom of the inner bottom portion and an outer surrounding wall surrounding on top of the outer bottom portion and enclosing an outer of the inner surrounding wall; wherein each one of the securement sections of the conductive pins extends to arch between the inner bottom portion and the inner surrounding wall.
申请公布号 US2015129295(A1) 申请公布日期 2015.05.14
申请号 US201314076780 申请日期 2013.11.11
申请人 I-CHIUN PRECISION INDUSTRY CO., LTD. 发明人 LI Ting-Hsi;LIN Yu-Jen
分类号 H01L33/62 主分类号 H01L33/62
代理机构 代理人
主权项 1. A double-shot injection molding formed LED lead frame structure, comprising: an inner base comprising an inner bottom portion and an inner surrounding wall surrounding on top of the inner bottom portion, the inner surrounding wall forming a central hollow portion on top of the inner bottom portion, and the inner bottom portion having an inner surface facing toward the central hollow portion; a plurality of conductive pins with each one thereof constructed by a soldering section, a securement section and an extension section respectively; and an outer base enclosing an outer of the inner base and the securement sections of the plurality of the conductive pins and comprising an outer bottom portion attached to a bottom of the inner bottom portion and an outer surrounding wall surrounding on top of the outer bottom portion and enclosing an outer of the inner surrounding wall, wherein each one of the soldering sections of the plurality of conductive pins is received within the central hollow portion and is attached to the inner surface; each one of the securement sections of the plurality of conductive pins extends to arch between the inner bottom portion and the inner surrounding wall; and each one of the extension sections of the plurality of conductive pins is connected to the securement section and extends outward to an outer of the outer base.
地址 New Taipei City TW