| 发明名称 |
SEMICONDUCTOR PACKAGE HAVING MAGNETIC SUBSTANCE AND RELATED EQUIPMENT |
| 摘要 |
Provided is a semiconductor device. A semiconductor chip is disposed on a substrate. A first magnetic substance, a second magnetic substance and a third magnetic substance which are spaced apart from one another are formed on the semiconductor chip. The first magnetic substance and the second magnetic substance can be adjacent an edge of the semiconductor chip. The third magnetic substance can be adjacent a center of the semiconductor chip. The third magnetic substance is between the first magnetic substance and the second magnetic substance. |
| 申请公布号 |
US2015130075(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201414330636 |
申请日期 |
2014.07.14 |
| 申请人 |
Ji Sang-Wook;Mun Hyoung-Yol;Park Yeong-Lyeol;Lee In-Kyum |
发明人 |
Ji Sang-Wook;Mun Hyoung-Yol;Park Yeong-Lyeol;Lee In-Kyum |
| 分类号 |
H01L23/00;H01L23/14 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a substrate; a semiconductor chip disposed on the substrate; and a first magnetic substance, a second magnetic substance and a third magnetic substance which are spaced apart from one another on the semiconductor chip, wherein the first magnetic substance and the second magnetic substance are adjacent an edge of the semiconductor chip, the third magnetic substance is adjacent a center of the semiconductor chip, and the third magnetic substance is between the first magnetic substance and the second magnetic substance. |
| 地址 |
Seoul KR |
