| 发明名称 |
Semiconductor Package Comprising Two Semiconductor Modules and Laterally Extending Connectors |
| 摘要 |
A semiconductor package includes a mold body having a first main face, a second main face opposite to the first main face and side faces connecting the first and second main faces, a first semiconductor module including a plurality of first semiconductor chips and a first encapsulation layer disposed above the first semiconductor chips, and a second semiconductor module disposed above the first semiconductor module. The second semiconductor module includes a plurality of second semiconductor channels and a second encapsulation layer disposed above the second semiconductor channels. The semiconductor package further includes a plurality of external connectors extending through one or more of the side faces of the mold body. |
| 申请公布号 |
US2015130048(A1) |
申请公布日期 |
2015.05.14 |
| 申请号 |
US201314077694 |
申请日期 |
2013.11.12 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Hohlfeld Olaf;Hoegerl Juergen;Beer Gottfried;Hoier Magdalena |
| 分类号 |
H01L25/065;H01L21/56;H01L23/31 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a mold body comprising a first main face, a second main face opposite to the first main face and side faces connecting the first and second main faces; a first semiconductor module comprising a plurality of first semiconductor chips and a first encapsulation layer disposed above the first semiconductor chips; a second semiconductor module disposed above the first semiconductor module, the second semiconductor module comprising at least one second semiconductor chip and a second encapsulation layer disposed above the at least one second semiconductor chip; and a plurality of external connectors extending through one or more of the side faces of the mold body. |
| 地址 |
Neubiberg DE |
