MODULE IC PACKAGE STRUCTURE WITH ELECTRICAL SHIELDING FUNCTION AND METHOD FOR MANUFACTURING THE SAME

摘要

A module IC package structure includes a substrate unit, an electronic unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate and a grounding layer disposed inside the circuit substrate. The grounding layer is exposed from the outer surrounding peripheral surface of the circuit substrate. The electronic unit includes a plurality of electronic components disposed on the circuit substrate. The electronic components are electrically connected to the grounding layer through the circuit substrate. The package unit includes a package gel body disposed on the circuit substrate to enclose the electronic components. The shielding unit includes a metal shielding layer disposed on the outer surface of the package gel body and the surrounding peripheral surface of the circuit substrate. The metal shielding layer directly contacts the grounding layer, thus the electronic components are electrically connected to the metal shielding layer through the grounding layer.

主权项

1. A module IC package structure with electrical shielding function, comprising:
a substrate unit including a circuit substrate having an outer surrounding peripheral surface, a grounding layer disposed inside the circuit substrate and enclosed by the circuit substrate, and an inner conductive structure disposed inside the circuit substrate and electrically connected to the grounding layer, wherein the inner conductive structure includes a plurality of inner conductive layers, and each inner conductive layer has a first end directly contacting the grounding layer and a second end opposite to the first end and exposed from the outer surrounding peripheral surface of the circuit substrate; an electronic unit including a plurality of electronic components disposed on the circuit substrate and electrically connected to the circuit substrate, wherein the electronic components are electrically connected to the grounding layer through the circuit substrate; a package unit including a package gel body disposed on the circuit substrate to enclose the electronic components; and a shielding unit including a metal shielding layer disposed on the outer surface of the package gel body and the surrounding peripheral surface of the circuit substrate, wherein the metal shielding layer directly contacts the second end of each inner conductive layer, and the grounding layer is electrically connected to the metal shielding layer through the inner conductive structure.