| 摘要 |
<p>A composition, which is curable at room temperature, comprises resorcinol diglycidyl ether, a fusible polyepoxyalkoxy phenol-aldehyde resin and a solid aromatic or heterocyclic polyamine, the phenol-aldehyde resin having the formula <FORM:0908969/IV(a)/1> where R is hydrogen or an alkyl, aryl, aralkyl, alkaryl, cycloalkyl or furyl radical; X and Y are hydrogen, chlorine, alkyl or hydroxyl; R1 is hydrogen, chlorine, alkyl, aryl, aralkyl or alkaryl; m is at least 3; Z is hydrogen or an epoxyalkyl radical containing not more than 10 carbon atoms, at least 3 Z's in the polymer chain being epoxyalkyl; the units being derived from 0,5 to 3 mols. of aldehyde per mol. of phenol, provided that when the ratio exceeds 0,8 the phenol is ortho- or para-substituted. The composition may also comprise an aliphatic polyepoxide, e.g. butadiene dioxide, as well as a plasticizer, solvent and fillers. In the polyamine, each nitrogen atom must have at least one hydrogen atom attached thereto. Examples are the phenylene diamines, N,N1-di-2-naphthyl-p-phenylene diamine, diaminophenol and its HCl salt, 2,4-diaminoanisol, 4-methoxy-6-methyl-m-phenylene diamine, benzidine, 2,4-diaminoazobenzene, N,N1-diphenylethylene diamine, 4,41-diaminodiphenyl sulphone, 2,21-diamino-4,41-dinitrodiphenylmethane, p,p1-methylenedianiline, 4,41,411-triaminophenylmethane, diaminonaphthalenes, 1,4-diamino-anthraquinone, 1,3-diamino-dihydroanthraquinone, 2,6-diamino-pyridine, 2,4-diamino-6-hydroxy-pyrimidine and 3,6-diamino-9-methyl-carbazole. Many substituted phenols as well as phenol itself are specified for the resin. The aldehydes include formaldehyde, acetaldehyde and other aliphatic aldehydes, benzaldehyde, toluic aldehyde, naphthaldehyde, furfuraldehyde, glyoxal, acrolein and hexamethylene tetramine. The epoxyalkoxy groups are introduced by reacting the phenol-aldehyde resin with epichlorhydrin or other haloepoxy alkanes. Suitable plasticizers are the esters such as dioctyl phthalate, dibutyl maleate, butyl stearate, octyl acrylate and tricresyl phosphate; polyalkylene polysulphides; amides such as dicyandiamide, sulphonamides and polyamides; and monoepoxides, which may be pre-arected with amines. Other phenolic resins may also be added. Suitable solvents are aromatic hydrocarbons, and esters, ethers, alcohols and ketones, as well as monoepoxides. The addition of monoepoxides serves also to chain-stop the resin. Specified fillers include mica, aluminium, asbestos, ground glass, and clays. Uses: Adhesives for joining wood, glass, metals, rubber, plastics, textiles.</p> |
