MULTI-LAYERED CERAMIC ELECTROIC COMPONENTS AND MOUNTING CIRCUIT THEREOF

摘要

Provided is a multi-layered ceramic electronic component. It has a multi-layered ceramic capacitor which has a first and a second external electrode formed by conductive paste at both ends of a ceramic body; and a first and a second connection terminal which is bonded to the mounting surface of the multi-layered ceramic capacitor and is connected to the first and the second external electrode at both ends of an insulating layer. The first and the second connection terminal includes an interposer substrate which includes a double layer structure of a first and a second conductive resin layer and a first and a second plating layer. The first and the second conductive resin layer are formed inside interposer substrate. The first and the second plating layer is formed outside interposer substrate.