发明名称 |
A method for bonding a pellicle, and a bonding apparatus used in this method |
摘要 |
Here is proposed a method for bonding a pellicle to a stencil such as mask plate, which is characteristic in that the stencilbonding agglutinant layer of the pellicle is warmed under load while the pellicle is being bonded to the stencil, preferably at a temperature in a range of 35 through 80 degrees C, and the load is increased stepwise and with intermittent removal of the load. |
申请公布号 |
EP2871521(A2) |
申请公布日期 |
2015.05.13 |
申请号 |
EP20140192204 |
申请日期 |
2014.11.07 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD |
发明人 |
YUICHI, HAMADA |
分类号 |
G03F1/00;G03F1/62;G03F1/64 |
主分类号 |
G03F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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