发明名称 電子部品実装装置
摘要 <p>An electronic component mounting apparatus (10) includes a head unit (30), a component supply device (14), a camera unit (36), and a controller (212) controlling the head unit (30) and the component supply device (14). The component supply device (14) has a holder (26) holding a plurality of electronic component accommodating tapes (100), each having storage cells (108) arranged in a row, the storage cells (108) storing electronic components (44), and a feeder (28) forwarding the electronic component accommodating tapes (100) and moving the storage cells (108) to a suction area (48) where the electronic component (44) can be suctioned by the nozzle (32). The camera unit (36) is fixed to a head support (31), and captures an image of the suction area (48). The controller (212) analyzes the image of the suction area (48) in the component supply device (14) obtained by the camera unit (36), and when the controller (212) determines that a portion of the electronic component accommodating tape (100) in the suction area (48) is a spliced portion based on a result of the analysis, the controller (212) determines that the electronic component accommodating tape (100) is changed.</p>
申请公布号 JP5715881(B2) 申请公布日期 2015.05.13
申请号 JP20110118306 申请日期 2011.05.26
申请人 JUKI株式会社 发明人 阿部 智貴
分类号 H05K13/04 主分类号 H05K13/04
代理机构 代理人
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