| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer capacitor capable of improving adhesion strength to a wiring board when built into the wiring board. <P>SOLUTION: A multilayer capacitor 10 comprises four belt-like first to fourth external electrodes 12 to 15 arranged in such a way as to circle around an exterior surface of a sintered body 11 in a direction orthogonal to the longer direction of the sintered body 11. The first to fourth external electrodes 12 to 15 arranged on side faces 11b and 11d of the sintered body 11 have widths wider than those of the first to fourth external electrodes 12 to 15 arranged on top faces 11a and 11b. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
