| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition for an adhesion adjuvant layer and an adhesion adjuvant layer for a plating process, wherein the composition exhibits high adhesive force with electroless copper plating and is to be used for a plating process capable of responding to an increase in the density of a semiconductor package, and to provide a laminate with an adhesion adjuvant layer for a plating process using the composition, and to provide a multilayer wiring board with an adhesion adjuvant layer for a plating process. <P>SOLUTION: The resin composition for an adhesion adjuvant layer for a plating process contains components of (A) an epoxy resin, (B) an epoxy resin curing agent and (C) a polyamide resin, and contains a polyamide modified epoxy prepolymer prepared by reacting the (A) epoxy resin and the (B) epoxy resin curing agent in the presence of the (C) polyamide resin. Then, there are provided: the adhesion adjuvant layer for a plating process; the laminate with an adhesion adjuvant layer for a plating process using the composition; and the multilayer wiring board with an adhesion adjuvant layer for a plating process. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
