INTERPOSER AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

The present invention relates to an interposer and a method for manufacturing the same, and a semiconductor package using the same. That is, the present invention includes a process of separating a passivation layer on a carrier by the medium of a bonding layer and then forming a conductive pattern layer on the passivation layer with a direct printing technique, a process of covering it with an insulating layer with a constant thickness, and a process of exposing part of the conductive pattern layer covered by the insulating layer. The processes are repeatedly carried out so that an interposer for manufacturing a semiconductor package with new structure can be secured. Conductive pattern layers are stacked to be electrically connected to each other. An insulating layer is interposed between the conductive pattern layers.