Light emitting diode and illumination device using same

摘要

The present invention relates to a light emitting diode (LED). The LED comprises an LED die, one or more metal pads, and a fluorescent layer. The characteristics of the present invention include that the metals pads are left exposed for the convenience of subsequent wiring and packaging processes. In addition, the LED provided by the present invention is a single light-mixing chip, which can be packaged directly without the need of coating fluorescent powders on the packaging glue. Because the fluorescent layer and the packaging glue are not processed simultaneously and are of different materials, the stress problem in the packaged LED can be reduced effectively.

主权项

1. A light emitting diode comprises:
a plurality of LED dies comprising an identical transparent substrate and a plurality of light emitting structures disposed on said transparent substrate; at least two metal pads setting on said transparent substrate, wherein top surfaces of said metal pads set on the same plane essentially; and a fluorescent layer setting on at least one of said LED dies and exposing said metal pads, wherein the thickness of said fluorescent layer is greater than 30 um; wherein each of said light emitting structures comprises a first semiconductor, a light emitting layer set on said first semiconductor layer, and a second semiconductor layer set on said light emitting layer; and wherein said transparent substrate comprises a support surface and a second main surface corresponding to said support surface.